FIELD: computer equipment.
SUBSTANCE: invention relates to a silicon microcircuit device. Structural device consists of first ceramic substrate (1) with upper (1b) and lower (1a) sides, note here that metallization (2) is applied on top side (1b), on which Si-microcircuit (4) is mounted by means of connecting means (3) with its lower side. At that, cooling of Si-microcircuit (4) is realized by means of elements with increased heat conductivity and simultaneously increased electric conductivity and at that efficiency of structural unit is increased, in compliance with proposed solution, connection device (5) is applied on upper side of Si-microcircuit (4), on which its lower side is coated with flat ceramic substrate (6), and on flat substrate (6) by metallization (7) there is a second ceramic substrate (8), wherein the flat ceramic substrate (6) comprises metal-filled thermoelectric interlayer connections (11), filled with copper, and flat ceramic substrate consists of aluminum nitride.
EFFECT: disclosed is a two-way cooling circuit.
5 cl, 2 dwg
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