MANUFACTURING METHOD OF PRINTED-CIRCUIT BOARDS Russian patent published in 2016 - IPC H05K3/46 H05K3/38 H05K3/42 

FIELD: electricity.

SUBSTANCE: in order to set electric contact between layers via holes are drilled up to metal layer at the opposite side of foil-coated glass fibre plastic and filled with copper by galvanic method simultaneously with metallization at formation of electric circuits at both sides of glass fibre plastic plate.

EFFECT: production of printed circuit boards using lead-free brazing alloys and excluded usage of expensive palladium, improved reliability and increased service life of PCBs.