FIELD: radio engineering.
SUBSTANCE: in method for manufacturing of printed circuit boards transition holes are filled with melt of alloy having melt temperature below temperature of dielectric destruction, from which printed circuit board is made, and prior to application of protective metal resistive coating, electric circuit is covered with copper or other metal, having high electric conductivity.
EFFECT: improvement of ecological purity of the process, manufacturing of printed circuit boards, which do not contain water, salts of metals and gases that are ingressed in process of chemical and galvanic metallisation in dielectric base and in metal coating.
3 cl
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