MANUFACTURING METHOD OF RELIEF PRINTED-CIRCUIT BOARDS Russian patent published in 2011 - IPC H05K3/10 H05K3/22 

Abstract RU 2416894 C1

FIELD: electricity.

SUBSTANCE: above said is performed after application of protective polymer coating. At that, relief of electrical diagram is developed in polymer coating without damaging to woven-glass reinforced base.

EFFECT: damage to capillary-porous structure of fibre-glass laminate is avoided, its humidity resistance and reliability parametres are increased, relief picture in the form of grooves and transient holes is designed, and they are bonded.

4 cl

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RU 2 416 894 C1

Authors

Slushkov Aleksandr Mikhajlovich

Baranenkov Evgenij Jakovlevich

Dates

2011-04-20Published

2010-04-12Filed