FIELD: radio electronics; printed-circuit boards for electronic devices.
SUBSTANCE: proposed manufacturing process includes sequential coverage of metal wafer and internal surface of auxiliary holes with chromium oxide insulating coating having resistivity ρ ≥ 1 · 109 Ohms* cm and electricity conducting solderable nickel or cobalt coating. Coatings are produced in thermal disintegration of chromium in environment of dopes enhancing electrical resistance of chromium oxide coatings (boron acid, aluminum acetyl acetonate, and the like); nickel (cobalt) coating is obtained in thermal disintegration of dicyclopentadienyl and acetylene acetonate complexes.
EFFECT: reduced cost, facilitated procedure, simultaneous metal evaporation on surface and holes, reduced size and weight.
4 cl, 3 ex
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