METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARDS Russian patent published in 2010 - IPC H05K3/02 H05K3/06 H05K3/46 

FIELD: radio engineering.

SUBSTANCE: in method for manufacturing of printed circuit boards from glass-cloth laminate foiled on both sides, high-temperature organic film is applied onto metal foil, "dead" and through transition holes are drilled with diametre of 100 micrometre, and electroconductive nickel or cobalt, or copper coating is applied on their inner surface by means of thermal decay of these metals carbonyls, afterwards organic protective film is removed either with laser beam or mechanical milling, or by photolithography, electroconductive circuits are produced on both sides of copper foil, which are protected by metal resist together with inner coating of transition holes on the basis of Wood or Rose's alloy, or tin-lead. In order to produce multi-layer printed circuit boards, two and more single-sided printed circuit boards are glued between each other serially with a layer of polymer from the side of electroconductive circuits.

EFFECT: production of printed circuit boards on the basis of foiled glass-cloth laminate, simplification and cheapening of technical process.

2 cl, 2 ex