FIELD: process engineering.
SUBSTANCE: claimed method comprises the steps that follow. a) Contactless glue application by the nozzle on the polymer film back. b) The polymer film is subjected to backing onto substrate board with the help of backing roller and counter pressure roller opposite the backing pressure at substrate board rear. Note here that the substrate board is subjected to cleaning in direction of transfer upstream of backing roller at the first step cleaning station with the help of brushes working across each other. At feed of forced air with static voltage removed by ionic rod and with suction of used air containing fine dust. At the second step, wet cleaning is performed with the application of organic solvents and fabric not containing silicon.
EFFECT: perfected coating process.
17 cl, 6 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| SUBSTRATE BOARD BACKING BY POLYMER FILM | 2011 |
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