FIELD: process engineering.
SUBSTANCE: invention relates to light industry, particularly, to substrate board backing by polymer film. Claimed process comprises the steps that follow. a) Polymer film back side facing the substrate boar surface is subjected to corona effects at appropriate machine. b) Glue is applied by a contactless process with the help of spraying on the polymer film back side. c) The polymer film is subjected to backing onto substrate board with the help of backing roller and counter pressure roller opposite the backing pressure at substrate board rear. The polymer film is kept stretched during the process up to backing. Substrate board feed rate is some 0.001-0.3 m/min higher than rpm of the backing roller. Between the polymer film corona discharge processing and glue application time difference equals at least 10 s. Between application of fused glue and backing the time difference equals at least 5 s. Relative humidity is adjusted at all process steps.
EFFECT: perfected coating process.
12 cl, 6 dwg, 1 ex
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