FIELD: radio engineering; communication.
SUBSTANCE: use for burn-thin films deposited on the dielectric substrate. Invention consists in that the method includes cleaning the surface of circuit boards by wiping with alcohol or acetone to degrease the surface was placed the product in a convection oven chamber so that the atmosphere had access to the conduction layer boards, burn-products produced in an air atmosphere at a temperature of 100-170°C for 85-340 hours, at the end of burn-check board adhesion tape with adhesive, clean the surface of the boards by rubbing alcohol or acetone from the remnants of the adhesive layer on the boards, by inspection products with a microscope for detachment conductor layer.
EFFECT: enable the identification of potentially insecure metallic thin film structures and hidden defects microstrip boards in the parameter interlayer adhesion by burn-conductors.
4 cl, 1 dwg, 1 tbl
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Authors
Dates
2016-03-20—Published
2014-12-17—Filed