FIELD: non-destructive quality control.
SUBSTANCE: invention relates to a means of non-destructive quality control of plated through holes (PTH) of printed circuit boards (PCB). The effect is achieved by the fact that in the method of non-destructive diagnostics of defects of the PTH PCB, the upper edge of the metallization during the theat is heated by a laser beam of a given power, focused along its boundaries, where theat ≈ 3(8r)2/at, r is the hole radius, at is the thermal diffusivity of the PCB material. At the end of heating, the temperature of the upper ТU and lower ТL edges of the hole metallization is measured using an IR camera in a non-contact way, and the defects of the PTH are judged by the difference of these temperatures δT = ТU - ТL and by the ratio of their increments: ΔТU/ТL, where ΔТU = ТU - Т0, ΔТL = ТL - Т0, Т0 is the initial temperature. In this case, when δT exceeds the threshold value δTthr, a conclusion is made about the defectiveness of the hole metallization, and if q = [(ΔТU/ΔТL)-1]-1 exceeds the threshold value qthr, a conclusion is made about the defectiveness of the adhesion of the metallization with the PCB dielectric, where the values of δTthr and qthr are determined from the results of sample measurements on a representative sample of the PTH of a given standard size.
EFFECT: increase in the reliability of detecting defects and ensuring the possibility of their identification.
1 cl, 2 dwg
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Authors
Dates
2021-12-13—Published
2021-05-25—Filed