METHOD FOR MANUFACTURING MICROWAVE MICROSTRIP BOARDS WITH METALLIZED HOLES BASED ON MICROWAVE DIELECTRIC SUBSTRATES MADE OF HIGH-FREQUENCY CERAMIC MATERIALS WITH HIGH DIELECTRIC CONSTANT Russian patent published in 2023 - IPC H05K3/02 H05K3/42 

FIELD: radio electronics; microelectronics.

SUBSTANCE: invention is used to create microwave microstrip boards with transition metallized holes based on microwave dielectric substrates for rocket, space and ground-based instrumentation. The technical result is the creation of microwave microstrip boards with metallized holes based on microwave dielectric substrates made of high-frequency ceramic materials with high dielectric constant, allowing the production of microwave microstrip boards based on ceramic blanks up to two millimetres thick inclusive with metalized holes and a maximum diameter of each transition hole equal to the thickness of the workpiece. The technical result is achieved by the fact that the method includes: bilateral sequential vacuum deposition of a technical layer on the substrate in the form of an adhesive layer of chromium and a layer of copper that removes heat from local overheating areas in areas of laser hole formation; laser formation of holes in a ceramic substrate, etching of the technical layer to the substrate material, chemical cleaning of the substrate, sequential double-sided vacuum deposition of an adhesive layer of chromium, a layer of copper and a chromium “mirror” onto the substrate as a protective layer with metallization of the holes in a single technological cycle; formation of a topological pattern by creating a mask of negative photoresist on both sides of the substrate by centrifugation, etching the protective layer to copper in the opened mask windows, galvanic deposition of a gold layer into the mask windows open to copper, etching layers of copper and adhesive chromium from the free field of the surface of the microstrip board to substrate material.

EFFECT: creation of microwave microstrip boards with metallized holes based on microwave dielectric substrates made of high-frequency ceramic materials with high dielectric constant, allowing the production of microwave microstrip boards based on ceramic blanks up to two millimetres thick inclusive with metalized holes and a maximum diameter of each transition hole equal to the thickness of the workpiece.

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