METHOD FOR MANUFACTURING MICROWAVE MICROSTRIP BOARDS WITH METALLIZED HOLES BASED ON MICROWAVE DIELECTRIC SUBSTRATES Russian patent published in 2023 - IPC H05K3/02 H05K3/42 

FIELD: radio electronics and hybrid microelectronics.

SUBSTANCE: used to create microwave microstrip boards with metallized holes based on ceramic substrates made of VK-100 type material, widely used in rocket, space and ground-based instrumentation. The method includes laser formation of holes in a ceramic substrate, cleaning the substrate, double-sided vacuum deposition of an adhesive chromium sublayer and a full-size copper layer with metallization of the holes due to through sputtering, application of photoresist by centrifugation, exposure of the photoresist through a photomask, in which the overall dimensions of each element are increased by the thickness of the deposited copper layer, the formation of a topological pattern by chemical etching of layers of copper and chromium to the substrate and the galvanic build-up of a protective mask of gold onto the topological pattern of the board, in which electrical contact is made due to the electrical contact of the screen with the topological pattern of the board through metallized transition holes.

EFFECT: creation of microstrip boards for the microwave range with transition metallized holes with a diameter of 0.2 mm to 2 mm based on microwave dielectric substrates made of high-frequency materials with high dielectric constant, thickness from 0.2 mm to 2 mm, with a transition resistance of the front-to-face connection of the back side of the substrate is less than 0.01 Ohm, with adhesion of conductive elements to the substrate material of at least 1.5 kgf/mm², with manufacturing accuracy of conductive elements with tolerance± 10 microns.

3 cl, 1 dwg, 1 tbl