FIELD: electronic equipment.
SUBSTANCE: invention relates to production of flexible-rigid printed circuit boards (FRPC). Technical result is achieved by a method for manufacturing flexible-rigid circuit board, comprising forming by photolithography and subsequent galvanic deposition of conductive components of circuitry on combined flexibly rigid support FRPC plating finish and protective coatings before applying final coating on rigid part and slots in contact windows, flexible part FRPC applied protective dry solder mask, which is light-cured via UV-irradiation, is subjected to polymerisation for a predetermined circuit protective mask, followed by a final step of metallisation FRPC then removed windows above flexible part together with mask before full surface disclosure flexible part FRPC.
EFFECT: method of producing flexible-rigid printed circuit board, a protection of flexible part (foiled polyimide with copper conductors and cover film) from effect of aggressive chemicals at stage of formation of finishing electroconductive coating (hot melting POS or immersion coating).
1 cl, 3 dwg, 1 ex
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Authors
Dates
2016-04-10—Published
2014-11-27—Filed