MANUFACTURING METHOD OF TEXTURED PRINTED-CIRCUIT BOARD Russian patent published in 2016 - IPC H05K3/00 

Abstract RU 2604721 C1

FIELD: electrical engineering.

SUBSTANCE: invention is used in electrical engineering and radio engineering, in particular, in textured printed-circuit boards (TPCB) manufacturing technology. Enabled by that method comprises electric circuit components forming on workpiece dielectric base by metallization of electric circuit textured outlines mechanically pre-formed by milling at CNC machines, copper effective layer application on dielectric base, dye application for highlighting of sections, not subjected to removal, copper layer etching outside textured outline, removal of dye layer from textured outline, application of protective soldering mask by photolithography with contact pads opening for soldering, application of water-soluble flux layer, high-temperature application of finishing coating by tin-lead alloy. At that, prior to hot tinning operation introducing protective soldering mask (liquid or dry) application operation, which protects TPCB surface during hot tinning operation in bath with POS solder.

EFFECT: technical result is production of increased reliability and heat resistance textured board.

1 cl, 1 ex

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RU 2 604 721 C1

Authors

Vorontsov Jurij Fedorovich

Zakharova Ljudmila Timofeevna

Martynov Sergej Vladimirovich

Polienko Anatolij Grigorevich

Luchkin Denis Aleksandrovich

Tetereva Valentina Alekseevna

Dates

2016-12-10Published

2015-06-24Filed