FIELD: electrical engineering.
SUBSTANCE: invention is used in electrical engineering and radio engineering, in particular, in textured printed-circuit boards (TPCB) manufacturing technology. Enabled by that method comprises electric circuit components forming on workpiece dielectric base by metallization of electric circuit textured outlines mechanically pre-formed by milling at CNC machines, copper effective layer application on dielectric base, dye application for highlighting of sections, not subjected to removal, copper layer etching outside textured outline, removal of dye layer from textured outline, application of protective soldering mask by photolithography with contact pads opening for soldering, application of water-soluble flux layer, high-temperature application of finishing coating by tin-lead alloy. At that, prior to hot tinning operation introducing protective soldering mask (liquid or dry) application operation, which protects TPCB surface during hot tinning operation in bath with POS solder.
EFFECT: technical result is production of increased reliability and heat resistance textured board.
1 cl, 1 ex
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Authors
Dates
2016-12-10—Published
2015-06-24—Filed