METHOD FOR ELIMINATION OF DIELECTRIC BY LASER RADIATION FROM CONDUCTORS AND OUTPUTS OF INTEGRATED CIRCUIT Russian patent published in 2013 - IPC H05K3/28 

FIELD: electricity.

SUBSTANCE: conductors and outputs are shaped at dielectric base of the integrated circuit. The base is covered by protective layer from the side of conductors leaving the area for conductors and outputs free of this layer. Further they are connected to metal plate by means of soldering and thereafter the dielectric base is irradiated by laser. Then metal plate is separated from conductors and outputs of the integrated circuit, for example, by means of heated air directed flow.

EFFECT: possibility of dielectric removal from conductors and outputs in any place of the integrated circuit by laser radiation provided that their integrity is maintained and additional protective materials are not used; possibility to form with high accuracy of a free area with removed layer of dielectric with complicated geometry.

2 cl, 1 dwg