METHOD FOR MANUFACTURING HIGH-FREQUENCY PRINTED CIRCUIT BOARDS Russian patent published in 2022 - IPC H05K3/22 H05K3/34 

FIELD: electrical engineering.

SUBSTANCE: invention relates to the field of radioelectronic engineering and can be used in manufacture of printed circuit boards of various radioelectronic equipment and radioelectronic apparatuses with preset radiotechnical characteristics, including high-frequency radioelectronic equipment of space vehicles, operating under the impact of conditions of space, with long duration of active existence. The result is achieved by the fact that, in the method for manufacturing HF PCB, including formation of a topological pattern of conductors on a foiled material by the photolithography method using a photo template, in PCB containing sections providing the required RTC of the HF PCB, part of the PCB intended for REP installation is executed using a photoimageable protective soldering mask PSM. A PSM is therein applied to the surface of the PCB with a topological conductor pattern, using an additional photo template, by exposure and subsequent developing windows are formed in the PSM, the contours and placement whereof correspond to the points of installation of the REP terminals forming the CP for soldering the REP terminals in the HF PCB sections providing the required RTC of the HF PCB.

EFFECT: creation of a method for manufacturing high-frequency printed circuit boards (HF PCB), providing a possibility of forming, in the areas of HF PCB ensuring the required radiotechnical characteristics (RTC) thereof, contact platforms (CP) for mounting the terminals of radioelectronic products (REP) allowing a reliable soldered connection of the terminals of REP and HF PCB CP while complying with the required RTC of the HF PCB.

6 cl