METHOD OF MAKING ELECTRONIC ASSEMBLIES ON FLEXIBLE SUPPORT WITHOUT SOLDERING AND WELDING PROCESSES Russian patent published in 2016 - IPC H05K3/46 H05K3/30 

FIELD: radio engineering, communication.

SUBSTANCE: method is carried out by making electronic assemblies of radioelectronic equipment on a flexible support and includes making a drawing on a foil-coated polymer by photolithography, mounting naked chips with the active side downwards and component chips on the base using polymer lacquer, sealing, making holes in the polymer structure to the leads of the electronic components by plasma-chemical etching, mounting components by magnetron sputtering of metals in a vacuum, growing the required number of layers by photolithography on polymer photosensitive lacquer, forming large external contact pads for subsequent mounting on printed-circuit boards made of any material, such as fibre-glass plastic, ceramic, polyimide and other materials.

EFFECT: providing a method of making maximally compact, reliable, high-speed and cheaper-to-manufacture electronic assemblies of radioelectronic equipment by avoiding soldering and welding processes when making the electronic assemblies.

13 dwg