FIELD: technological processes.
SUBSTANCE: invention can be used in making high-temperature soldering is permanently connected plate heat exchanger. Metal heat exchange plates, having temperature of solidus above 1,100 °C, are arranged one after another and form pack with alternating inter plate spaces. Each plate of heat exchanger has heat exchange area and surrounding it edge area. Heat exchange area includes corrugation of elevations and recesses produced by die forming plates. On surface corrugation is applied reducing melting point composition containing at least 25 wt% of boron and silicon. During heating of first and second plates to temperature above 1,100 °C surface corrugation melts together with step-down melting point component to form compound in points of contact between plates at their cooling.
EFFECT: invention allows simple and reliable production of strong connection of plate heat exchanger plates.
29 cl, 9 dwg, 14 tbl, 10 ex
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Authors
Dates
2016-05-10—Published
2013-03-28—Filed