NEW CONCEPT OF HIGH-TEMPERATURE SOLDERING Russian patent published in 2016 - IPC B23K35/02 B23K35/365 

FIELD: metallurgy.

SUBSTANCE: invention relates to metallurgy, specifically to mixtures for high-temperature soldering. Mixture for joining metal articles by high-temperature soldering comprises a boron source and a silicon source in form of powder at a ratio of boron to silicon in a mixture of 3:100 up to 100:3 and at least one binder selected from a group consisting of solvents, water, oils, gels, lacquers, varnish, binder based on monomers and/or polymers, wherein main metal of articles has solidus temperature higher than 1,040 °C.

EFFECT: simplified process of making high-strength joints of basic metal compounds by reducing number of heat-resistant additives.

43 cl, 6 dwg, 14 tbl, 10 ex