FIELD: metallurgy.
SUBSTANCE: invention relates to high-temperature soldering. Mechanical mixture of particles of powders for high-temperature soldering of the product contains at least one source of boron and at least one source of silicon. Particles have average size of less than 250 mcm, each particle is source of silicon or boron source. Mechanical mixture contains boron and silicon in weight ratio of boron to silicon in range from 5:100 to 1:1; silicon and boron are present together in mechanical mixture in concentration of at least 25 wt%. At least one source of boron and at least one source of silicon are oxygen-free except for unavoidable amounts of polluting oxygen of less than 10 wt%.
EFFECT: simplified process of soldering of heat-resistant additives.
3 9cl, 6 dwg, 19 tbl, 13 ex
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Authors
Dates
2016-06-10—Published
2013-03-27—Filed