FIELD: metal soldering.
SUBSTANCE: invention relates to the soldering of metal parts (11,12) having a solidus temperature above 1100°C. A melting temperature lowering composition (14) is applied to the surface (15) of the first metal part (11), which contains a melting temperature lowering component comprising at least 25 wt.% boron and silicon. The second metal part (12) is brought into contact with the melting temperature-lowering composition (14) at the point (16) of contact on the said surface (15). The first and second metal parts (11, 12) are heated to a temperature above 1100°C to ensure solidification of the molten metal layer (210) of the first metal component (11) to obtain a joint (25) at the point (16) of contact.
EFFECT: mentioned boron is at least partially derived from a chemical compound of boron selected from the following compounds: boric acid, borax, titanium diboride and boron nitride, which are safe and contribute to a strong connection between metal parts.
14 cl, 14 dwg, 6 tbl
Title | Year | Author | Number |
---|---|---|---|
PLATE HEAT EXCHANGER | 2013 |
|
RU2583204C1 |
PLATE HEAT EXCHANGER | 2013 |
|
RU2602693C2 |
NEW CONCEPT OF HIGH-TEMPERATURE SOLDERING | 2013 |
|
RU2585886C2 |
METHOD OF CONNECTING METAL PARTS | 2013 |
|
RU2592331C2 |
COATED WITH LAYER OF REFRACTORY ALLOY ARTICLE | 2013 |
|
RU2581937C1 |
METHOD OF JOINING METAL PARTS | 2014 |
|
RU2633171C1 |
NEW CONCEPT OF HIGH-TEMPERATURE SOLDERING | 2013 |
|
RU2585888C2 |
COMPOSITE POWDER FOR COMBINATION OR SURFACING BY DIFFUSION BRAZING OF COMPONENTS FROM SUPERALLOYS | 2011 |
|
RU2572948C2 |
NEW COATING CONCEPT | 2013 |
|
RU2585146C1 |
SOLID SOLDER, HARD SOLDERING METHOD, SOLDERED ARTICLE AND PASTE CONTAINING SAID HARD SOLDER | 2007 |
|
RU2458770C2 |
Authors
Dates
2022-11-23—Published
2020-05-08—Filed