FIELD: technological processes.
SUBSTANCE: invention can be used in producing soldered structures from aluminium and its alloys. Solder in the form of a wire contains components in the following ratio, wt%: silicon 12±0.3, zinc 12.5±2.5, aluminium – balance.
EFFECT: solder ensures high-quality soldering at temperatures not higher than 570 °C, which allows its use for soldering most structural aluminium alloys.
1 cl, 2 tbl
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Authors
Dates
2018-07-23—Published
2017-07-19—Filed