FIELD: chemistry.
SUBSTANCE: invention relates to a method of reducing icing of a substrate. Method includes applying to a substrate a curable film-forming composition comprising: (a) a resinous component comprising: (i) a polyepoxide; (ii) a polysiloxane; and (iii) an organooxysilane; (b) a polyamine and/or an aminosilane; (c) one additional polysiloxane different from polysiloxane of (ii), and (d) optionally a catalyst. Film-forming compositions can be applied directly to surface of substrate or onto a primer coat on substrate.
EFFECT: invention reduces icing at extreme temperatures.
15 cl, 2 tbl, 1 ex
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