METHOD OF REDUCING ICING OF SUBSTRATE Russian patent published in 2016 - IPC C09D5/00 C09D133/04 C09D175/04 C09D183/04 C09D167/00 C09K3/18 

FIELD: physics.

SUBSTANCE: method can be used for reducing icing of a substrate, for example, windmill blade. Method comprises applying on a substrate curable film-forming compositions containing curing agent with isocyanate functional groups, and a film-forming polymer with reactive functional groups with respect to isocyanate groups curing agent, and polysiloxane in curable film-forming composition in an amount sufficient to reduce icing substrate under conditions contributing to formation of ice. Polysiloxane contains polydimethylsiloxane and at least two functional hydroxyl and/or amino group or polysiloxane contains at least one polysiloxane containing at least one functional group which is reactive with respect to functional groups, at least one other component curable film-forming composition, and at least one polysiloxane which is not reactive with respect to functional groups of other components of the curable film-forming composition. Film-forming composition can be applied directly on substrate surface or on primer coat and/or upper coating on substrate.

EFFECT: technical result is providing, when curing, maximum average load on coated substrate of 450 N during testing for ice adhesion.

11 cl, 2 tbl