FIELD: electricity.
SUBSTANCE: invention relates to electrically insulating kompaunds, which can be used for filling or impregnation parts of electrical machines, devices, current-conducting circuits and parts in radio engineering, electrical and electronic industries. Compound consists of diglycidyl ether of resorcinol, methyl endyc anhydride, 2-ethyl-4-methylimidazole, pulverized quartz and hydrophobic modified pyrogenic silicon dioxide with the following ratio of components, wt%: diglycidyl ether of resorcinol 20, methyl endyc anhydride 27.7, pulverized quartz 51.2, 2-ethyl-4-methylimidazole 0.1, hydrophobic pyrogenic silicon dioxide, modified by hexamethyldisilazane, 1.0.
EFFECT: higher of heat resistance, electrical and mechanical strength of compound is the technical result of the invention; besides, electric insulating compound allows to reduce thickness of insulation with preservation of reliability of product at previous level.
1 cl, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
ELECTRICALLY INSULATING FILLING COMPOSITION | 0 |
|
SU1134583A1 |
ELECTRICAL EMBEDMENT COMPOUND | 2008 |
|
RU2356116C1 |
THERMOSET BINDER WITH HIGH GLASS TRANSITION TEMPERATURE | 2022 |
|
RU2802318C1 |
COMPOSITION FOR IMPREGNATION, FILLING AND POTTING | 0 |
|
SU1712386A1 |
EPOXY COMPOSITION | 0 |
|
SU1154298A1 |
DIRECT FILLING | 2010 |
|
RU2528845C2 |
EPOXY COMPOSITION FOR PRODUCING ELECTROENGINEERING AND STRUCTURAL ARTICLES | 0 |
|
SU896033A1 |
EPOXY COMPOSITION | 0 |
|
SU781205A1 |
INSULATION COMPOUND | 0 |
|
SU801108A1 |
THERMOSETTING BINDER | 2020 |
|
RU2749720C1 |
Authors
Dates
2016-09-27—Published
2015-09-28—Filed