FIELD: epoxy.
SUBSTANCE: invention relates to the development of a thermosetting epoxy binder processed into a polymer composite material (PCM) using injection technologies with a molding temperature of up to 150°C, for the manufacture of structures, including large-sized ones. Thermosetting binder comprises the following ratio of components, parts by weight: ED-22 - 10-80; N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane - 20-90; 2-methylimidazole - 1.0; resorcinol - 1.3; methylendic anhydride - 103.2-160.5.
EFFECT: increase in the glass transition temperature of the binder while maintaining a low viscosity of the binder.
2 tbl, 9 ex
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THERMOSETTING BINDER | 2020 |
|
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|
RU2663444C1 |
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|
RU2453565C1 |
Authors
Dates
2023-08-24—Published
2022-12-12—Filed