FIELD: chemistry.
SUBSTANCE: invention relates to development of an epoxy composition for rapid repair of defects in process equipment. Disclosed is an epoxy binder containing 100 wt.pts. epoxy diane resin “ЭД-20”, 1 wt.pts. catalyst – 1-methylimidazole, from 11.28 to 33.08 wt.pts. methylendic anhydride and from 7.68 to 23.04 wt.pts. 4,4'-diaminodiphenylsulphone. A mixture of methylenedic anhydride and 4,4'-diaminodiphenylsulphone is used as a hardener.
EFFECT: proposed approach enables to increase the Vicat heat resistance of the composition while maintaining satisfactory physical and mechanical characteristics.
1 cl, 2 tbl, 3 ex
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