FIELD: electronics.
SUBSTANCE: group of inventions relates to processing electronic printed circuit boards. Hollow container with scrap electronic printed circuit boards is placed in a medium of a liquid coolant, heated to temperature or higher melting temperature of tin-lead solder, after melting tin-lead solder, hollow container emptied of coolant and then by rotation molten tin-lead solder and coolant residue are removed therefrom. Device comprises an open-top container with liquid coolant and installed therein with possibility of rotation of hollow container, made in form of a rotation body and to designed to accommodate scrap electronic printed circuit boards. Hollow container is liquid-permeable in radial direction from axis of rotation and can move vertically to empty liquid coolant, wherein liquid coolant is heated to temperature or above melting temperature of tin-lead solder.
EFFECT: extraction of tin-lead solder from scrap of electronic printed circuit boards.
4 cl, 3 dwg
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