FIELD: food industry.
SUBSTANCE: invention relates to food industry and can be used in production of end products by cutting flat and hollow wafer blocks. System (1) includes main cutting device (3), in which there is device (12) for contour cutting. Device (12) cuts blocks (B) on contour cuts across straight transfer path. Transportation path extends in lengthwise direction of system. Main transportation device (6) located along transfer path, moves blocks (B) through device (12) for contour cutting. Device (12) for contour cutting includes at least one module (13) for contour cutting, which is equipped with at least one cutting tool (14a). Tool (14a) which can move back and forth in transverse direction of system and performs contour cutting in blocks (B), moving through device (12) for contour cutting in longitudinal direction of system.
EFFECT: higher quality of finished product.
47 cl, 32 dwg
Title | Year | Author | Number |
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Authors
Dates
2016-11-20—Published
2013-07-22—Filed