FIELD: chemistry.
SUBSTANCE: invention relates to aqueous polishing composition having pH from 3 to 11. Composition contains (A) at least one type of abrasive particles, which are positively charged during dispersion in an aqueous medium, free of component (B) and having pH in range from 3 to 9, that is confirmed by electrophoretic mobility. Abrasive particles (A) are non-organic particles, containing or consisting of cerium dioxide. Composition contains (B) at least one anionic phosphate dispersant, selected from a group of water-soluble condensed phosphates, wherein water-soluble condensed phosphate is selected from a group, consisting of metaphosphates of general formula I: [M+n(PO3)n] (I); and polyphosphates of general formula II and III: M+nPnO3n+1 (II); M+H2PnO3n+1 (III); where M is ammonium, sodium and potassium and index n is ranges from 2 to 10,000. Composition contains (C) at least one component based on a polyatomic alcohol, selected from a group (c1) of polyatomic alcohols, wherein polyatomic alcohol (c1) is contained in amount of 0.005 to 5 wt% in terms of weight of said composition (c2) of mixture, consisting of (c21) at least one polyatomic alcohol and (c22) at least one water-soluble or water-dispersible polymer, (c3) mixtures (c1) and (c2). Described also is a method of polishing substrates for electrical, mechanical and optical devices and application of aqueous polishing composition for making electrical, mechanical and optical devices.
EFFECT: technical result is providing a composition having improved selectivity with respect to silicon oxide in comparison with silicon nitride even more than 50 to obtain polished plates having excellent global and local flatness.
8 cl, 6 tbl, 30 ex
