COMPOSITION FOR CHEMICAL-MECHANICAL POLISHING (CMP) CONTAINING PROTEIN Russian patent published in 2017 - IPC C09G1/02 C09K3/14 B24B1/00 H01L21/304 H01L21/461 

Abstract RU 2631875 C2

FIELD: chemistry.

SUBSTANCE: invention relates to the composition for chemical-mechanical polishing (CMP) and its use in polishing substrates of a semiconductor industry. The composition comprises cerium oxide particles, a protein containing cysteine as an amino acid unit, and an aqueous medium.

EFFECT: composition exhibits improved polishing characteristics.

12 cl, 1 tbl

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RU 2 631 875 C2

Authors

Li Yuzhuo

Noller Bastian Marten

Lauter Mikhael

Lange Roland

Dates

2017-09-28Published

2013-01-25Filed