FIELD: chemistry.
SUBSTANCE: present invention relates to a method for bonding a thermoplastic polymer to a thermosetting polymer component. Thermosetting polymer component includes an implant of thermoplastic polymer. Thermoplastic polymer has a melting temperature that exceeds curing temperature of thermosetting polymer. Heat is applied to melt thermoplastic polymer, to be bonded. Thermoplastic polymer of implant is located on fused interface. Implant is designed such that heating above maximum operating temperature of thermosetting polymer at interface of implant with thermosetting polymer component is avoided during bonding step. Temperature gradient is maintained due to usage of heat sinks on parts of implant, which are removed after bonding.
EFFECT: wider range of thermosetting polymers to be bonded by fusion with other thermosetting polymers or thermoplastic polymers.
14 cl, 4 dwg
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