FIELD: electrical engineering.
SUBSTANCE: invention relates to electrical engineering, specifically to a printed circuit board, comprising substrate (1), on which there is at least one ceramic component (2, 3, 4) so as to provide for removal of heat released by ceramic component (2, 3, 4) and prevent occurrence of cracks in ceramic component (2, 3, 4) and in substrate. For this purpose, ceramic component (2, 3, 4) is fixed on substrate (1) with using two connectors (5, 6) made from composite material with a metal matrix. Said two connectors have good heat conductivity, preferably have recesses for transfer of mechanical stresses.
EFFECT: preventing cracking of ceramic component due to low thermal mechanical stress is technical result of invention.
5 cl, 5 dwg
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