METHOD OF DOUBLE-SIDE METALLIZATION OF CERAMIC PLATES Russian patent published in 2018 - IPC C04B41/88 H05K3/40 

FIELD: technological processes.

SUBSTANCE: invention relates to a technology of applying metallic coatings to ceramic plates and can be used in electronic and radio electronic industry in the production of metallized substrates for electronic and light-emitting modules. Method of double-side metallization of ceramic plates is to fill through holes with a silver-containing paste with the viscosity of 75…80 Pa*sec using a screen mesh with the open surface coefficient of 0.25…0.40, through the cells of which in two passes into the holes with a squeegee the silver-containing paste is pressed, herewith during the second working stroke of the squeegee a vacuum of 0.01…0.05 Pa is created from the underside of the plate. Then, using a silver-containing paste with the viscosity of 45…60 Pa*sec, a topological metallization pattern is first applied onto the underside of the plate followed by a low-temperature heat treatment, then onto the working side of the plate. Finally, a high-temperature annealing is carried out. Silver-containing pastes for filling the through holes and for applying topological metallization patterns differ in their compositions.

EFFECT: method makes it possible to obtain a high-quality double-side metallization of ceramic plates using through holes.

6 cl, 2 tbl