FIELD: electronic technology.
SUBSTANCE: invention relates to the field of electronic technology and microelectronics and can be used in the manufacture of powerful microwave devices, transistor housings, power modules and LEDs. The essence of the invention consists in the fact that in the process of metallization of aluminum nitride ceramics, including preliminary heat treatment of ceramics in superheated water vapor, application of metallization paste to the surface of ceramics by the method for grid printing and firing paste, additionally after heat treatment of ceramics in superheated water vapor at a temperature of 400°C for 50 minutes, the ceramic surface to be metallized is impregnated in a boiling aqueous solution of inorganic salts for 1-2 hours, and then dried in air at a temperature of 90-100°C. Impregnation is carried out with a 10% solution of aluminum ammonium alum or a 5% solution of chromium chloride.
EFFECT: invention makes it possible to increase the strength of ceramics, as well as to increase the adhesion of the metallization coating to aluminum nitride ceramics after its firing.
3 cl, 3 tbl
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR METALLISATION OF ALUMINIUM NITRIDE CERAMICS | 2020 |
|
RU2759248C1 |
METALLISATION TECHNIQUE FOR ALUMINIUM NITRIDE CERAMICS | 2014 |
|
RU2559160C1 |
METHOD FOR METALLIZATION OF CERAMIC PRODUCTS | 2021 |
|
RU2777312C1 |
METALLISING PASTE AND METHOD OF ALUMINIUM NITRIDE CERAMICS METALLISATION | 2013 |
|
RU2528815C1 |
METALLISATION METHOD OF CERAMICS USING METAL-COATED TAPE | 2018 |
|
RU2711239C2 |
COMPOSITION FOR METALLIZATION OF CERAMICS | 2022 |
|
RU2803271C1 |
CERAMICS METALLIZATION METHOD | 2019 |
|
RU2803161C2 |
HEAT SINK ELEMENT AND METHOD OF ITS MANUFACTURE | 2019 |
|
RU2806062C2 |
PASTE FOR ALUMINIUM NITRIDE CERAMICS METALLIZATION | 2015 |
|
RU2619616C2 |
METHOD OF METALIZING CERAMIC SUBSTRATES | 2023 |
|
RU2819952C1 |
Authors
Dates
2022-08-17—Published
2021-10-07—Filed