FIELD: physics.
SUBSTANCE: invention relates to thermally conductive dielectric materials and can be used for manufacture of heat-removing gaskets, tapes, sealants, filling compounds for computer memory chips, power electronic products, portable devices, power supplies and power converters, for which it is necessary to provide heat removal from heat-loaded elements and assemblies. A thermally conducting polymer composite material comprising a matrix based on silicone rubber or epoxy material with a filler in an amount of 0.1-80% by total weight of the thermally conductive composite material, wherein the filler is made in the form of aluminum oxide particles, the dimension of which is expressed in nanometers and micrometers, in combination with alumina nanofibers in an amount of 0.1-50% by total weight of the thermally conductive composite material and in the form of alumina nanofibers only in an amount up to 80% of the total weight of thermally conductive composite material, at that, the nanofibers are randomly arranged in the polymer matrix or oriented along the direction of heat flow from the heat-loaded surface.
EFFECT: invention provides thermally conducting composite material with high thermal conductivity.
3 ex
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Authors
Dates
2017-03-24—Published
2015-11-10—Filed