HEAT-CONDUCTING COMPOUND Russian patent published in 2020 - IPC C09K3/10 C08L83/04 C08K3/10 C08K3/22 C08K3/36 

FIELD: chemistry.

SUBSTANCE: invention relates to polymer composite materials intended for high-voltage sealing of articles and systems of technical purpose, operating in modes requiring efficient removal of excess heat energy during operation. Heat-conducting compound consists of two components: polymer-containing base (component A) and hardening mixture (component B), in weight ratio: per 100 pts. wt component A is from 3 pts. wt up to 12 pts. wt component B. Component A is a mixture of low-molecular weight silicone rubber with molecular weight 15,000–55,000 standard units with silicone oligomer, with fine aluminum hydroxide, optionally, silicon oxide, and component B is a mixture of ethyl silicate and organotin salt, selected from tin octoate and tin diethyldacapralate, and optionally a silicone oligomer, and optionally polyethylene polyamine.

EFFECT: invention increases compatibility of processing properties – relatively low viscosity, filling properties, high viability, with heat conductivity, dielectric and physical and mechanical properties.

1 cl, 6 tbl