POLYMER HEAT-CONDUCTING HIGHLY ELASTIC COMPOSITE MATERIAL Russian patent published in 2020 - IPC C09K5/00 

FIELD: manufacturing technology.

SUBSTANCE: invention relates to the field of heat conducting dielectric materials and can be used in production of heat-removing gaskets, tapes, sealants, filling compounds for electrical and electronic devices, power electronics products, portable devices, power supply units and power converters, in which it is necessary to provide heat removal from heat-loaded elements and units. Technical result is achieved by introducing filler into a matrix based on silicone rubber or silicone sealant, diluted with silicone oils in amount of 30 % to 40 %, wherein filler is made in form of particles of hexagonal boron nitride with size of 0.8 to 35 mcm in amount of 0.1–80 % of total weight of polymer heat-conducting high-elastic composite material, and in form of particles of synthetic microdiamonds in amount of up to 10 % of total weight of said material, wherein particles of synthetic microdiamonds can be randomly arranged in the matrix.

EFFECT: high heat conductivity and compressibility coefficient of heat-conducting composite material with low density.

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