SOLDER ALLOY, SOLDER BALL LEAD, SOLDER FOR MICROCIRCUIT CHIP, SOLDER PASTE AND SOLDERED JOINT Russian patent published in 2019 - IPC B23K35/26 C22C13/00 

FIELD: metallurgy.

SUBSTANCE: invention relates to soldering, particularly, to soldering of microcircuits. Said alloy contains 0.005 wt. % to 0.1 wt. % Mn, 0.001 wt. % to 0.1 wt. % Ge and more than 0 wt. % to 4 wt. % Ag. Main ingredient of the alloy is Sn. Due to said content of Mn and Ge in solder alloy, most of Ge oxides are distributed on outer surface of oxide film containing oxides of Sn, oxides of Mn and Ge oxides, creating effect of preventing change of colour at high humidity. In addition, Mn and O₂ are reacted by suppressing the formation of oxides between Sn and O₂, which provides suppression of thickness of oxide film and improves properties of soldered connection.

EFFECT: solder alloy can be used in solder ball lead, solder for IC, solder paste and soldered joint.

12 cl, 3 dwg, 3 tbl