FIELD: metallurgy.
SUBSTANCE: invention relates to the field of metallurgy, in particular lead-free solder, and can be used in apparatus and devices with soldered connections that are exposed to high temperatures. Lead-free solder contains, by mass%: Sn 76.0–99.5, Cu 0.1–2.0, Ni 0.01–0.5, Bi 0.1–5.0, Ge from 0.0001 to less than 0.01, inevitable impurities – the rest.
EFFECT: it is possible to carry out soldering with high reliability without reducing the strength of the solder joint, including in a state exposed to high temperatures for a long time.
4 cl, 9 dwg, 13 tbl
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