FIELD: chemistry.
SUBSTANCE: invention relates to lead-free solder, as well as to soldered joint obtained using said solder. Lead-free solder has Sn-Cu-Ni base and contains, wt.%: 0.1–2.0 Cu, 0.01–0.5 Ni, 0.1–5.0 Bi, 0.0001–0.1 Ge and 76.0–99.5 Sn. Besides, solder contains at least one element selected from the group: Sb 0.1–5.0 and Ga 0.001–1.0.
EFFECT: invention enables soldering with high reliability without reducing strength of soldered joint at high temperature effect for a long period of time.
5 cl, 9 dwg, 13 tbl
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