FIELD: ceramic industry.
SUBSTANCE: invention relates to methods of brittle materials cutting (thermo cracking), such as plates from any type of glass, all types of ceramics, as well as semiconductor materials, and can be used in automotive industry for glasses and mirrors production, in electronic industry, as well as in other industries. Method comprises heating material surface of along cutting line using laser beam, creation of blind material cut along cutting line, additional effect on material surface in cut application area with resilient waves, material surface heating zone cooling using coolant, wherein resilient waves act on material surface in cooling agent action area. Additional effect on material surface is performed, at least, by two sources of resilient waves, which are arranged on material opposite sides across cutting line, wherein waves are produced, which amplitude and frequency are selected under condition of resilient standing wave area generation in material with periodic change of mechanical stresses, combined with heating area, for cut deepening to specified depth or through cutting. Heating zone is formed by pulsed laser beam, and resilient standing wave areas are combined with formed heating zone, wherein laser radiation maximum intensity is combined with time of mechanical stresses maximum unloading. Additionally several pulse laser beam heating zones can be formed to create additional cutting lines.
EFFECT: technical result consists in increase of materials cutting speed and increase in cut material thickness.
3 cl, 1 dwg
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Authors
Dates
2017-04-25—Published
2015-12-03—Filed