FIELD: wood industry.
SUBSTANCE: sampling of the material, undergoing physical stress, is performed. The selected of the finished particle board material thickness samples, subjected to flexural-torsional vibrations at a frequency of 1…2 Hz over a temperature range from room temperature to 270…300°C to obtain a temperature dependence of dynamic shear modulus and dynamic shear modulus jump near the temperature corresponding to the curing temperature of the thermosetting binder, the incompleteness of the curing process of thermoset binder chipboards is determined.
EFFECT: possibility of immediate availability of laboratory monitoring of not cured thermosetting binder in the thick chipboard.
6 dwg, 1 tbl
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