MULTILAYER PRINTED CIRCUIT BOARD Russian patent published in 2000 - IPC

FIELD: radio engineering, manufacture of multilayer printed circuit boards. SUBSTANCE: proposed multilayer printed circuit board includes package of dielectric substrates with holes and metallization having thickness of 5-500 μm and fabricated in the form of pattern of conductors and lands. Metallization layers of substrates are separated by insulating layers. Multilayer printed circuit board is provided with heat conducting parts with protrusions and package is made of dielectric substrates with one-side metallization. Metallization layers are interconnected in parallel by input and output lands and heat conducting parts are put with their protrusions into two additional holes of package as minimum. Dielectric materials of substrates in this case are insulating layers with thickness of 5-150 μm. EFFECT: proposed multilayer printed circuit board has widened technological capabilities which allows high-efficiency radio engineering devices to be developed. 2 dwg