FIELD: technological processes.
SUBSTANCE: stamp for embossing contains a mould and a printing form made with a structured surface, connected to the mould with a possibility of separation. For connection, an adhesive is used, to which metal powder is added. The adhesive has a heat resistance, providing stamp operation at a temperature of up to 250°C with the exception of printing form detachment from the mould.
EFFECT: possibility is provided to reuse the mould with replacement of only a very thin layer of the printing form with the embossing relief.
11 cl, 2 dwg
