FIELD: printing industry.
SUBSTANCE: method for controlling deviations in the width of conductors from nominal values when manufacturing a printed circuit board contains the calculation of the wave impedance of a conductor in the form of a microstrip line on a double-sided printed circuit board for specified values of the dielectric constant and the thickness of the board base, the thickness of the metallization layer and the width of the test conductor; on the test board with the given values of the dielectric constant and the thickness of the base of the board, the thickness of the metallization layer, using the technology used by the manufacturer, a test sample with a test conductor of a specified width is made; with the help of a dynamic reflectometer, measure the impedance of the test conductor; find the difference between the values of the calculated wave impedance of the test conductor and the measured wave impedance of the conductor on the test sample of the printed circuit board; calculate the coefficient of influence of the relative error of the width of the tested conductor on the error of the wave resistance; the relative error of the wave resistance of the conductor of the test sample is divided by the calculated coefficient of influence, the resulting value indicates the relative manufacturing error of the conductor width in the tested photolithographic process for formation of the printed board conductors; multiplying the relative manufacturing error by the nominal value of the tested conductor width, the absolute manufacturing error of the printed circuit board conductors width.
EFFECT: ensured possibility of increasing the efficiency and reducing the complexity of monitoring compliance with conductors width tolerances.
2 dwg
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Authors
Dates
2017-10-31—Published
2016-04-22—Filed