TEST-COUPON AND METHOD OF MONITORING ERRORS OF COMPATIBILITY OF LAYERS OF MULTI-LAYERED PRINTED BOARD Russian patent published in 2018 - IPC H05K1/02 G01R31/28 

FIELD: printing industry.

SUBSTANCE: test-coupon of compatibility errors of the layers of multi-layered printed board consists of 2n pairs of printed conductors oriented along the side of the MPP. Moreover, each pair of conductors is placed on adjacent layers of MPP metallization one under the another with an offset in the direction. The pairs of conductors' form two groups of n pairs, for each next pair in the group the offset is increased by the value of the discrete offset Δ relative to the offset of the previous pair.

EFFECT: reducing the complexity of the measurement process and processing the results of monitoring.

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