FIELD: technological processes.
SUBSTANCE: method of soldering, at least, two glass substrates to each other comprises applying a paste containing a solder and an inductive binder to, at least, one substrate. Bringing, at least, the second substrate into contact with the composition in the form of a paste. Induction heating of the substrates and paste to obtain a seal between the glass substrates.
EFFECT: decreasing the temperature gradient and the difference in the expansion coefficients between the glass and the junction.
26 cl, 3 dwg
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