METHOD OF TESTING ELECTRONIC COMPONENTS Russian patent published in 2018 - IPC G01R31/28 G01N25/72 

FIELD: electrical engineering.

SUBSTANCE: invention relates to the electronic industry, in particular to the electronic components testing means and methods, including in their manufacture. Proposed is a method of electronic components testing, which includes the following stages: placing at least one tested electronic component at a predetermined position in the test vessel; lowering the thermal group mounted above the contact surface with the contact presses, arranged in accordance with the arrangement of the electronic components, and comprising at least one Peltier element, to said at least one electronic component, wherein the pressers are in contact with the electronic components without a gap; performing the power control of said thermal group to reach a predetermined temperature by at least one said Peltier element and at least one electronic component, wherein the temperature change by means of the pressers happens due to the thermal conductivity; performing at least one electronic component parameters testing at a given temperature; stopping the electronic components testing with following raising of the thermal group and removing of at least one electronic component from the test vessel.

EFFECT: increase in the testing effectiveness and reducing of the mechanical stress level of electronic components.

13 cl, 3 dwg