FIELD: chemistry.
SUBSTANCE: method involves treatment of a semiconductor material sample with a solution of HNO3 and HCl acids, taken in a volume ratio of 1:3, and with ultrasound to transfer additives from the material surface to the solution, selection of a solution aliquot for subsequent determination of additives on the material surface, followed by material washing until supernatant components are removed and decomposed in an autoclave with a mixture of HNO3, HCl, HF acids, taken in an amount dissolving the tin dioxide, the resulting solution is analyzed by inductively coupled plasma mass spectrometry to determine the additives concentration in the material volume.
EFFECT: increased accuracy and reliability of the analysis.
2 cl, 1 ex, 2 tbl
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Authors
Dates
2018-03-29—Published
2017-04-25—Filed